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2023³â ±¹³»Çмú´ëȸ- PROGRAM[5¿ù 10ÀÏ(¼ö)~ 11ÀÏ(¸ñ)]

1. ÁÖÁ¦: ¼¼°è ¼­ÇöóÀÌ Ã¼ÀÎ º¯È­ ´ëÀÀÀ» À§ÇÑ ¹ÝµµÃ¼/µð½ºÇ÷¹ÀÌ Àåºñ/ºÎÇ° ±â¼ú 
2. ÀϽà ¹× Àå¼Ò: 2023³â 5¿ù 10ÀÏ(¼ö)~11ÀÏ(¸ñ), Á¦ÁÖ´ë ¾Æ¶óÄÁº¥¼ÈȦ(Á¦ÁÖ) 
3. ÁÖÃÖ: Çѱ¹¹ÝµµÃ¼µð½ºÇ÷¹À̱â¼úÇÐȸ(¹ÝµµÃ¼¡¤µð½ºÇ÷¹ÀÌ ÇùÀÇü)

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00:00~
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09:00~
09:20

°³È¸»ç(ÃÖ¸®³ë Á¶Á÷À§¿øÀå(ÀÎÇÏ´ë)

Àλ縻(ÇÐȸÀå ¹× ÀÎÇÏ´ë ºÎÃÑÀå, ÀÎõ½Ã °ü°èÀÚ)


-
Plenary Session

09:20~
09:50
Plenary [1]: ±èÇüÁØ ´ÜÀå(Â÷¼¼´ëÁö´ÉÇü¹ÝµµÃ¼»ç¾÷´Ü)
"                                "

09:50~
10:20
Plenary [2]: À̺´ÈÆ ±³¼ö(Æ÷Ç×°ø´ë):
"ÀÌÁ¾Á¢ÇÕ ÁýÀû±â¼ú½Ã´ëÀÇ ÃÊÀúÀü·ÂÄÄÇ»Æñâ¼ú"
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10:20~
10:40
Coffee Break¹®

10:40~
11:10
Plenary [3]: »ï¼ºÀüÀÚ(¾È):
"                                  "

11:10~
11:40
Plenary [4]: ±è¿µÃ¶ »ó¹«(½ºÅÂÃ÷ĨÆÑÄÚ¸®¾Æ) :
"ÀÌÁ¾ÁýÀû ½Ã´ëÀÇ ¹ÝµµÃ¼¡¤µð½ºÇ÷¹ÀÌ ±â¼ú"
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12:10~
13:40
Á¡½É ¹× ÀÌ»çȸ °³ÃÖÇ¥
- Session 1
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±Ç´ë¿õ ±³¼ö
(ÀÎÇÏ´ë)
Session 2
ÈÄ°øÁ¤:
±è¿µ±¹ ±³¼ö
(ÀÎÇÏ´ë)
Session 3
¼ÒÀçºÎÇ°Àåºñ:
±èÅ°³¼ö
(ÇѾç´ë):

Session 4
NIS»ç¾÷´Ü:
¹ÚÈï¼ö ±³¼ö
(¿¬¼¼´ë):



13:40~
14:00

±èÇüÁø ±³¼ö
(ÀÎÇÏ´ë):
¸Þ¸ð¸® ¹ÝµµÃ¼¸¦ È°¿ëÇÑ ÇÁ·Î¼¼½Ì-ÀÎ-

¸Þ¸ð¸® ±â¼ú

±èº´Áø ¼ö¼®
(¾ÚÄÚÄÚ¸®¾Æ):
Semiconductor packaging
solution for high
board level

reliability

Á¶»óÁØ Àü¹«
(ÆÄÅ©½Ã½ºÅÛ½º):
¹ÝµµÃ¼ ¹× µð½ºÇ÷¹ÀÌ »ê¾÷¿¡¼­ÀÇ ÀζóÀÎ À¶ÇÕ AFM

¼Ö·ç¼Ç 2022
 

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¹ßÇ¥(1)

14:00~
14:20

¹èÁ¾È£ ±³¼ö
(±¹¹Î´ë):
Characterization of
HfO2-Based Ferroelectric
Memory Devices
Based on Charge-
Balance Model



±è¼ºµ¿ ±³¼ö
(¼­¿ï°ú±â´ë):

FOWLP ´ÙÃþ

±¸¸® Àç¹è¼±

°øÁ¤ ±â¼ú




Á¶¿ø¼· ¼ö¼®
(Çѱ¹¹Ù½ºÇÁ):
Electroplating in Semiconductor
Industry

¿ì¼ö°úÁ¦

¹ßÇ¥(2)

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14:20~
14:40
±è°¡¶÷ ±³¼ö
(¸íÁö´ë):
GaN-based light-emitting diode with hole spreading
layer for improving internal quantum efficiency and realizing white light
without phosphor

±è¿µ±¹ ±³¼ö
(ÀÎÇÏ´ë):
Do we understand the reliability

issues under
vibration correctly?

±èÁ¤ÀÎ ¿¬±¸¼ÒÀå'
(µà¶ó¼Ò´Ð):
´ÙÁßÃÊÀ½ÆÄ ¼¼Á¤

±â¼úÀÇ È¿°ú

¿ì¼ö°úÁ¦

¹ßÇ¥(3)
 

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16:00~
16:20
±èÇö¿ì ±³¼ö
(ÇÑ°æ´ë):
Frequency Doubler
based on Ferroeletric
Tunnel Field-
Effect Transistor



ÀÌÅÂÀÍ ¹Ú»ç
(»ý±â¿¬):
Novel Methods of
Flexible Bonding for
Advanced Electronic
Packages





±¸µÎ¹ßÇ¥(1)






¿ì¼ö°úÁ¦

¹ßÇ¥(4)






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16:20~
16:40
±èÀåÇö ±³¼ö
(ºÎ°æ´ë):
Analysis of Selfheating
Characteristic
in MOSFETs

±èÁÖÇü ±³¼ö
(ÀÎÇÏ´ë):

¹ÝµµÃ¼-µð½ºÇ÷¹ÀÌ

-¼¾¼­ ±×¸®°í

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IntegrationÀÇ
ÇÊ¿ä

±¸µÎ¹ßÇ¥(2)


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14:40~
16:00
Poster Session(1ºÐ ¹ßÇ¥ : °¢ Sessionº° ÁøÇà) & Coffee Break
: ÀÎÇÏ´ë Ç×°ø¿ìÁÖ»êÇÐÀ¶ÇÕ¿ø 1Ãþ ´ë°­´ç ·Îºñ

16:40~
16:50
Coffee Break


Plenary Session2 (ÁÂÀå : ÀÌÁ¤È¯ ±³¼ö(ÀÎÇÏ´ë))

16:50~
17:20

Plenary (6): ±èÁ¾Çå ºÎ»çÀå(³×Æнº):

"Advanced Package Technology Trend & Challenges
– Heterogeneous Integration"


17:20~
17:50

Plenary (7): °­ÁöÈ£ Fellow(SKÇÏÀ̴нº):

"3D Device ±â¼úÀÇ ÇöÀç¿Í ¹Ì·¡"


17:50~
18:00
¿ì¼ö³í¹®½Ã»ó½Ä ¹× Æóȸ(±è±¸¼º Á¶Á÷À§¿øÀå(°­³²´ë))

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