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12:30~ | Çà»ç µî·Ï | - | |||
13:00~13:10 | ¿¬±¸È¸ ȸÀå Àλ縻 | Á¤Áø¿í ±³¼ö (¿¬±¸È¸ ȸÀå) | |||
13:10~13:40 | ¹ÝµµÃ¼ °øÁ¤¿¡¼ÀÇ Àåºñ ±â¼ú°ú ¹Ì·¡ | ±èÅÂȯ ºÎ»çÀå (SKÇÏÀ̴нº) | |||
13:40~14:10 | ÃֽŠPlasma etchÀåºñÀÇ ¾ç»ê¼ºÀ» À§ÇÑ ¿ä°Ç | ¹ÚÁ¾Ã¶ ¸¶½ºÅÍ (»ï¼ºÀüÀÚ) | |||
14:10~14:50 | On the Smart R Wave source for HARC Etching | ÀåÈ«¿µ ±³¼ö (KAIST) | |||
14:50~15:00 | Break | - | |||
15:00~15:30 | Advanced packagingÀ» À§ÇÑ ÇöóÁ °øÁ¤ ÀåºñÀÇ ÀÀ¿ë | ÀåÁÖÈñ ¸Å´ÏÀú(KLA) | |||
15:30~16:00 | Precision RF Power Control in CVD/Etch Semiconductor Equipment | À̱âÈÆ ºÎ»çÀå (AE ÄÚ¸®¾Æ) | |||
16:00~16:40 | To be announced | ¿°±Ù¿µ ±³¼ö (¼º±Õ°ü´ë) | |||
16:40~16:50 | Break | - | |||
16:50~17:20 | 3D NAND Plug Etch Process ÀÇ ÇöÀç¿Í ¹Ì·¡ | ÀÌÀç¿ø ¹Ú»ç (SKÇÏÀ̴нº) | |||
17:20~18:00 | ÇÿøÀÚ ¼öÁØ ½Ä°¢ ÁõÂø °øÁ¤À» À§ÇÑ ÇöóÁ ¼Ò½º ±â¼ú | Á¤Áø¿í ±³¼ö (ÇѾç´ë) | |||
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