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12:30~ Çà»ç µî·Ï -
13:20~13:30 ¼Ò°³ ¹× ¿¬±¸È¸ ȸÀå Àλ縻 Á¤Áø¿í ±³¼ö
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13:30~14:00 ÃֽŠPlasma etch ÀåºñÀÇ ¾ç»ê¼ºÀ» À§ÇÑ ¿ä°Ç ¹ÚÁ¾Ã¶ ¸¶½ºÅÍ
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14:00~14:30 Memory ½ºÄÉÀÏ ¹× ½ºÅܾ÷ À§ÇÑ ÇöóÁ & RF ±â¼ú Àüº´°Ç TL
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14:30~14:45 ½Ä°¢ Àåºñ¸¦ À§ÇÑ Plasma ¹× °ü·Ã ±â¼ú Á¤½ÂÇÊ »ó¹«
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14:45~15:00 Challenges and Opportunities for Plasma Deposition Equipments Technology ½ÅÇüÁÖ »ó¹«
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15:00~15:15 Break -
15:15~15:30 TBD À̸í¹ü ºÎ»çÀå
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15:30~15:45 Plasma Enhanced Technologies for the Future Generations ¹Ú¿µ¿ì ºÎ»çÀå
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15:45~16:00 Ion beam ½Ä°¢ ÇöóÁ ±â¼ú À̱æ¿ë Àü¹«
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16:00~16:15 ÃֽŠÇöóÁ °øÁ¤À» À§ÇÑ RF & Matcher ±â¼ú Á¤Àçö Àü¹«
(MKS)
16:15~16:30 Break -
16:30~16:50 ±ØÀú¿Â ÀüÀÚ ¿Âµµ ÇöóÁ ¼Ò½º Á¤Áø¿í ±³¼ö
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16:50~17:10 RF/Microwave¸¦ Ȱ¿ëÇÑ ÇöóÁ½Ç½Ã°£ Á¤¹ÐÁø´Ü À¯½ÅÀç ±³¼ö
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17:10~17:30 Plasma Atomic Layer Etching for Dielectric and Metals äÈñ¿± ±³¼ö
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17:30~18:00 ÆÐ³Î µð½ºÄ¿¼Ç(±â¼ú ¹× Àη ¾ç¼º Çù·Â ¹æ¾È) ¹× ´Üü »çÁø ¸ðµç ¿¬»ç

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